Engineering Intelligence for the Real World
We go beyond general-purpose AI by engineering domain-specific intelligence — custom AI chips, optimized models, and system-level design, delivering performance where it matters most.
Edge AI
On-device intelligence that runs where the data is created — sensors, cameras, and the perception loop of a robot.
ASIC to Application
Full-stack delivery from silicon architecture through models to deployed software, including compact language models that run inside your walls.
Bio + Sensor Domains
Domain-specific systems for biology, genomics, and industrial sensing and PHM — not general-purpose AI.
Language, Specialized
Small models tuned to one domain and grounded in your own documents.
AI That Moves
Perception for robots, inside the battery budget and the control loop.
Machines That Report
Vibration and machine signals turned into a health index at the sensor.
Domain-specific AI, from silicon to system
Six solution areas covering the full stack: on-sensor chips, scalable multi-chip systems, and bio-AI co-design, now extended to language, robotics, and industrial sensing.
On-sensor AI Chip Solutions
AI processing directly at the sensor, enabling ultra-low cost and energy-efficient intelligence at the data source.
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Flexible Multi-chip AI Solutions
Modular and scalable AI systems combining multiple chips, optimized for domain-specific performance and flexible deployment.
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Bio-AI Co-design Services
Integrated AI and hardware co-design for biological data analysis, accelerating discovery through multimodal data and lab automation.
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Three additions, one architecture
Our answer has always been to put the intelligence next to the data. The new part is that "data" is no longer only pixels — it is also text, motion, and machine signals.
Domain-Specific Small Language Models
Compact language models tuned for one domain with supervised fine-tuning and grounded with retrieval — private translation and document intelligence that runs on-premise or on-device.
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Physical AI
Collaborative R&D with commercial robotics and humanoid teams in Korea and China — low-power perception for machines that sense and act in the real world.
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Industrial Sensing & PHM
Near-sensor processing of vibration, acoustic, temperature, and electrical signals for prognostics and health management — machines that report their own condition.
Learn more →From concept to real-world AI
A full-stack, domain-driven process that closes the distance between research and production.
Co-design
We co-design domain-specific AI solutions with our partners, starting from the real-world constraint — power, cost, latency, or data — rather than the model.
Silicon
We develop optimized AI semiconductors from architecture to silicon, across ASIC, FPGA, and full systems, with experience spanning 110nm to 7nm process nodes.
Deployment
We deliver end-to-end AI systems that bridge the gap between research and production — shipped, integrated, and operating in the field.
A decade of shipped systems
Build your real-world AI with us
From semiconductor design to full-stack system integration — we turn ideas into deployable solutions.
cs@uxf.ai · +82 (070) 4633-4641